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35 Microscopy and Characterization Suite Cameca 4000X HR local electrode atom probe LEAP Provides high-voltage pulse mass resolu- tion Field of view exceeding 150 nm Local electrode technology High spatial resolu- tion and sensitivity Automatically focused voltage and UV laser pulsing with small spot enable improved mass resolution better yield from poorly conductive samples and best in class data acquisition rates Improved signal-to-noise ratio Large angle reflectron LAR design is optimized for very high mass resolution while maintaining a wide field of view. Hysitron TI-950 triboIndenter nanoindenter and AFM Dual head testing capability Available force ranges from 30 nN to 10 N In-situ imaging provides nanometer precision test positioning and the convenience of SPM topography 500 nm resolution staging for sample positioning Automated testing for high throughput Top-down high-resolution color optics for viewing and selection of testing sites SPM im- aging ScanningWear to observe and quantify wear volumes and rates Scratch testing for quantification of scratch resistance critical delamination forces and friction coefficients Quasistatic nanoindentation to measure Youngs modulus hardness fracture toughness and other properties AFMMFM imaging Heatingcooling stages for investigation of mechanical properties at non-ambient temperatures Vacuum wafer mounting system that eliminates necessity of gluing or cutting wafers prior to testing NanoECR a conduc- tive nanoidentation system that provides simultaneous in-situ electrical and mechanical measurements High load head that goes up to 2 N Is equipped to operate in Ar and N environments. APT results of alloy Fe-Cr-Moyttria isosurface of 1.0 at. Y green 3.5 at. Mo red and 1.0 at. O blue showing Mo segregates next to oxide precipitates. The scale is in nanometers.