Fan-Yi Ouyang

Professor Fan-Yi Ouyang received her B.Sc and M.S. degree in Engineering and System Science from National Tsing Hua University at Hsinchu, Taiwan and Ph.D. in Material Science and Engineering, from University of California, Los Angeles in USA. Her Ph. D research focused on electromigration and thermomigration in eutectic SnPb and Pb-free flip chip solder joints. She then spent around 3 years at Intel Corporation, Portland technology Development Center as Quality and Reliability Engineer to evaluate first level interconnect reliability of various Si-Assembly process on 32 nm technology and develop first level interconnect process on 22 nm technology. She then joined Department of Engineering and System Science at National Tsing Hua University at Hsinchu in August 2010 and currently an Professor and Vice Chairman. She is also Associate Director in Center for Nanotechnology, Materials Science, and Microsystems at National Tsing Hua University in Taiwan She was received TMS EMPMD Young Leader Professional Development Award in 2014, Excellent Young Scientist Award of The Materials Research Society-Taiwan in 2020, and Excellent Young Professional Award of Taiwan Association for Coating and Thin Film Technology in 2020. Her current research interests include mass transport (diffusion) and interfacial reaction in electronic materials, thin film deposition and characterization, and high-temperature oxidation behavior of nuclear materials.