By developing radiation-hardened electronics that can operate reliably within a near core environment, the safety and operational efficiency of plants can be improved through early signal pre-amplification, analog signal processing, and analog to digital conversion. Wide bandgap semiconductors offer a potential solution to this issue, offering greater voltage breakdowns, higher current limitations, and faster switching speeds compared to traditional silicon devices. Gallium Nitride (GaN) transistors can provide reliable, safe communication and monitoring capabilities to these high-temperature, high radiation environments of advanced reactors.
This project focuses on testing samples of GaN transistors at the Ohio State University National Reactor Laboratory (OSU-NRL).These transistors will comprise of both E-mode and D-mode as well as analog and digital cells for wireless sensor communication devices. Experiments will beneeded to confirm the ability of the devices to function in environments with high temperature (>400°C), total ionizing dose (TID) (>100 Mrad (GaN)), and neutron fluence (~10^16 n/(cm^2 )).
The first round of testing will see the samples irradiated using a Co-60 gamma source delivered over 1000 hours to provide a total TID (Total Ionizing Dose) of 12 Mrad. OSU-NRL presents the capability for easy in-situ measurement for live monitoring of electrical properties. OSU-NRL also offers another unique capability, the ability to perform irradiations in external large dry tubes. These dry tubes are right next to the core and are available with an inner diameter of 6.5-in or 9.5-in providing a neutron flux up to 10^11 n/(cm^2 s). The second part of the testing will put the GaN samples under neutron irradiation with thetotal fluence obtained by the sample at about 10^(16 ) n/(cm^2 ). The in-situ capability of OSU-NRL will offer the unique opportunity to monitor the performance of the devices under the increasing doses as opposed to the usual “cook-and-look" approach offered by most studies with only post-irradiation characteristics. The lead wires for the in-situ testing will be calibrated with a control group to record the base line noise level induced between wires and connections. The third round of testing will focus on a gamma-neutron mixed irradiation with simultaneous heating to test the performance of the devices undergoing dynamic annealing from the high temperatures. The team will heat the devices up to 400℃ while achieving a combined gamma-neutron dose.
For the first irradiation, the team will measure and characterize the current-voltage (I-V) characteristics of the AlGaN/GaN HEMTs during and after irradiation. This will be performed using at least 2 source-meter units (SMUs) that will be switched between more than 16 selected AlGaN/GaN HEMT devices during irradiation. After irradiation, we will perform PIE using either SMUs or semiconductor parameter analyzers to characterize the devices’ electrical performance more accurately and precisely. These electrical characterizations will be use to develop circuit models for the devices which include the effects of radiation degradation to verify and improve existing SPICE models for electronics developed by DOE NE programs.